A QSFP module is a semiconductor device. A semiconductor device is an electronic device whose conductivity is between a conductor and an insulator. In the transceiver integrated optical module, the chip that realizes photoelectric conversion or electro-optical conversion is a semiconductor optoelectronic device. Due to the small size of the chip, in order to ensure the correct electrical and mechanical connection between the semiconductor optoelectronic device and the circuit, semiconductor packaging technology needs to be used to protect it from threats such as mechanical shock, chemical pollution and light. The package provides a way to connect it to the external circuit through leads such as pads, solder balls or pins, which helps to help dissipate the heat generated by the device, and at the same time, the packaged optical device can also be easily installed and transported. The packaging technologies of TOSA (Transmitter Optical Subassembly) and ROSA (Receiver Optical Subassembly) mainly include TO-CAN coaxial packaging, butterfly packaging, COB (Chip On Board) packaging, and BOX packaging.
The BOX package is a butterfly package and is used for multi-channel parallel packaging, as shown in Figure 2-17. Usually, optical modules with rates of 25G and below are mostly butterfly-shaped packages, with standard process and automation equipment, and low technical barriers. However, for high-speed optical modules with a rate of 40G and above, it is limited by the rate of the laser (mostly 25G), which is mainly realized by multi-channel parallelization. For example, 40G is realized by 4*10G, and 100G QSFP28 is realized by 4*25G. The packaging of high-speed optical modules puts forward higher requirements for parallel optical design, high-speed electromagnetic interference, volume reduction, and heat dissipation under increased power consumption.
COB packaging uses an adhesive to attach a semiconductor die directly to a PCB substrate, wire bond it to the circuit pattern already present on the board, and encapsulate it, as shown in Figure 2-18. Chip-on-board is the pinnacle of surface mount technology (SMT), and the difference between COB and SMT is essentially that COB typically involves high pin count, active devices and does not require ceramic or molded plastic external device packages.
COC packaging is to package the chip on the chip, and adhere the laser chip to the ceramic substrate, which can achieve miniaturization, light weight, high reliability and low cost. The traditional single-channel 10Gb/s or 25Gb/s rate optical module uses SFP package to solder the electrical chip and TO packaged optical transceiver components to the PCB board to form an optical module. For a 100Gb/s optical module, when using a 25Gb/s chip, 4 sets of components are required. If an SFP package is used, it will require 4 times the space. COC packaging can integrate the laser array and receiver array into a small space for miniaturization.
Conclusion
The integrated optical transceiver module mainly realizes the photoelectric signal conversion function in the field of optical communication. When the network layer of the client sends data to the physical layer, the physical layer will send the electrical signal containing the data to the optical module. At this time, the receiving end of the optical module TOSA converts the electrical signal into an optical signal and transmits it into the optical fiber. At this time, the optical signal containing data is sent to the optical module on the server side along the link layer. When the optical module at the receiving end receives the optical signal, ROSA converts the optical signal into an electrical signal. The physical layer transmits this electrical signal containing data to the network layer, where the network layer
It is transmitted to the application layer to complete the data transmission function. Therefore, with the continuous increase of the transmission data traffic, high-speed optical modules are indispensable in the entire data transmission network system. The 4´25Gps QSFP28 optical module is mainly composed of four parts: the main control chip MCU, the transmitter, the receiver, the electrical interface, and the PCB board. QSFPTEK uses the highest-end devices in every department, please contact us.